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BREAKING THE CAM BOTTLENECK
Data package problems? Try these steps to get front-end engineering
on the open road.
By: Shelley Krueger, Dave Barry, and Don Payne
These
are exciting times for the printed circuit manufacturing industry.
Fabricators are experiencing double-digit growth, maintaining staggering
backlogs, and shipping product at an unprecedented rate. Unfortunately,
this growth has also created significant bottlenecks in the front-end
engineering process.
A
hot market coupled with incoming data packages of varied quality,
outdated CAM systems, and a shallow talent pool have many front-end
engineering departments struggling with data package bottlenecks.
How can fabricators best resolve these bottlenecks and get onto
the open road?
For
starters, front-end engineering must be sure the rest of the front-end
process is as efficient as possible. To that end, here are suggestions
and checklists that can assist fabricators in the review of their
own front-end systems.
Data
Format: 274D vs. 274X
Bottleneck:
274D Gerber is one of the oldest tools available, and many designers
use this format as their sole output option. With 274D data, the
front-end operator is left to deal with many issues, some even prior
to data import:
Assume
the operator must manually specify (type) any size, shape, height,
width, length, break widths, inner diameters, outer diameters, and
positive and negative output. With 274D data, these options are
typically left to the operator's interpretation.
Unfortunately,
such interpretations often lead to output irregularities. Features
become the choice of the operator rather than the designer. A simple
aspect such as the angle of a thermal relief break can cause the
thermals to break into one another or even isolate, which may be
desired. If the thermal reliefs are surrounded by voids in the ground
(clearances) and the clearances lack sufficient annular rings to
ensure connections, the clearances must be enlarged to meet manufacturing
capabilities, thus causing the thermal to be isolated from the rest
of the ground plane.
This
may be the case with internal layer files, but the external files
can show the same data, such as the surface mount component's length
and width. The operator must determine whether the aperture wheel
calls out X first and Y second or Y first and X second. The wrong
choice may cause the surface mount land to short into another feature
or become oversized or undersized. A mistype of a circle instead
of a square may deprive the SM component of a land that is sufficient
to ensure the component is level during wave soldering.
When
typed incorrectly, soldermask clearance sizes can result in mask
on lands or enlarged clearances that expose traces.
Open
Road: When asking a fabricator to manually manipulate the aperture
wheel, the final part design is left to the front-end operator.
When a designer doesn't have the option to export files using 274X,
it is always helpful to provide the plotted artwork to the manufacturer
for verification. 274X provides a quick and efficient means of importing
data with no need for operator interpretation. The data provided
are the data tooled.
Drawn
Planes and Pads
Bottleneck:
Drawn planes are multiple overlapping traces or vectors used to
build a large copper feature. By drawing a plane rather than producing
layers in a negative format, one reduces the file sizes. In many
instances the use of drawn images is a necessity. If the design
remains functional after changing the data from positive to negative
at output of the Gerber data, the file size becomes smaller. Large
data files are due to mass amounts of trace data information.
When
working with drawn images, CAM operators may encounter these issues:
Open
Road: Output plane layers in a negative format.
Thieving
and Copper Balancing
Thieving
and copper balancing is the process of adding a copper pattern to
the outer layers of a board. Balanced copper helps to ensure even
plating and etching.
Bottleneck:
PCB designers have started adding copper thieving and balancing
to the copper layers. Unfortunately, if the design rules are shared,
the CAM operator is challenged with a confusing design rule check.
The computer has problems understanding these features and calls
out many errors.
Open
Road: The designer should give design rules for thieving to
the manufacturer, and the copper features should be added to the
CAM systems. An example of thieving design rules: 0.040" squares
on 0.070" centers and 0.100" spacing from any copper feature. All
added squares are to be covered with soldermask.
Standardized
Drawing Formats
Bottleneck:
Blueprints can be produced and exported in many different formats,
including HPGL, DWG, PLT, DXF, GBR, BMP, GIF, etc. To keep up with
customer demands, fabricators must purchase and be proficient with
many different types of software packages. Not only is all this
software costly, but guessing which software to load becomes a cumbersome
and time-consuming task. Having multiple software applications open
taxes computer memory, slowing the computer and the blueprint plotter.
Open
Road: During the initial business engagement with the customer,
the fabricator should suggest the optimal fabrication drawing format.
Early format collaboration provides front-end departments with a
clear understanding of what's required to move a job to production.
Standardized
Drawing Notes
Bottleneck:
Incomplete or inconsistent notes on the fabrication drawing.
Open
Road: Fabrication drawings should include the board specification
callout (or IPC-A-600); copper weight callout (1/2 oz., 1 oz., 2
oz., etc.); finish requirement (HASL, OSP, immersion gold, etc.);
hole size tolerance; specify plated vs. non-plated holes; silkscreen
color; board thickness and thickness tolerance; route tolerance;
scoring specification; quality requirements such as cross section,
ionic readings, certificate of compliance, impedance readings with
coupons, solder sample, electrical test certificate, etc.; pack
and ship instructions; and an impedance requirement that does not
reflect line width or dielectric callout.
Non-functional
Lands
Bottleneck:
Non-functional lands for the CAM engineer and the manufacturing
process engineer are a menace. Not only must the CAM engineer engage
in a secondary DfM to remove them, but this same process may also
lead to the removal of lands that are part of the design. For instance,
even if the trace is intended to fall just short of the land (0.001"),
the software may consider the land non-functional and remove it.
Open
Road: Designers should remove all non-functional lands.
Surface
Mount Spacing
Bottleneck:
As designs have become smaller and tighter, the applications to
produce these designs have not changed much. Most surface mount
parts are spaced at pitches of 0.025", 0.0197", or 0.016". A problem
arises when the component width is large enough that the air gap
is reduced to 0.007" or less. With a 0.007" or less air gap, soldermask
adhesion becomes extremely difficult. Fabricators prefer to have
a minimum of 0.003" covering the traces and at least of 0.002" clearances.
This is still quite hard to ensure. In most cases, the customer
or design requires that soldermask be applied between surface mount
lands. If the air gap falls below the minimum, then the manufacturer
will request a window void of the soldermask at that location.
(Also
take into consideration that there will be some etch compensation
enlargement prior to plot. This often times causes the CAM operator
to shave the sides of the surface mount lands to ensure that there
will be no lifting and redepositing of soldermask flakes onto other
features of the part.)
Open
Road: The standard rule should permit the windowing and voiding
of soldermask in the area. Otherwise, construct the land width small
enough to permit a 0.007" air gap.
Soldermask
Clearance
Bottleneck:
Many Gerber files for soldermask come with the clearance for the
features as one-to-one. If the manufacturer left this artwork as
is, the result will be end product with soldermask on lands. This
is not acceptable in most cases, though IPC standards permit encroachment
on one side of the feature (for surface mount). By providing the
soldermask data this way, it requires the CAM operator to increase
all features by the requirement of the manufacturer. Some potential
errors:
Often,
Gerber files for soldermask are so large that CAM software triggers
an error in the design. This causes the artwork to be questioned
and edited, slowing the process.
Open
Road: If all design software automatically increased the soldermask
by 0.006", these questions are eliminated.
Silkscreen
Size
Bottleneck:
Many silkscreen files are generated using an 0.008" to 0.010" draw.
In most cases, this is acceptable if the height is proportional.
On small-dimension parts, however, an 0.008" to 0.010" draw will
blur during the application process. This will cause a reject from
the customer or the quality department or both. The Gerber file
aperture size then must be reduced and left to the specification
of the fabricator.
Open
Road: Fabricator and customer/designer collaboration resulting
in a 0.006" to 0.007" draw for silkscreen applications will increase
the efficiency of the process.
Front-end
process efficiencies are the on-ramp to the open road. Always
give the customer a single contact with a backup contact so that
no information is misinterpreted. To know your customers and their
requirements, it is critical that manufacturers have the following
items:
After
these initial decisions are made, it is hoped that they may be applied
toward future designs.
Know
Your Capabilities
Every
manufacturing facility should have a capability listing for the
front-end planners and CAM operators. Planners and CAM operators
both need to understand the processes that are performed by the
fabricator. Generally, the most knowledgeable front-end employees
are those with experience in the production environment and who
taught front-end engineering. Through cross-training of this nature,
front end becomes an efficient extension of the manufacturing process.
Knowledge
of the following items is critical:
Tip:
Have a pre-order check, or educate the sales team about facility
capabilities.
The
planner must know the manufacturing facility and its capabilities.
By giving the process engineering department an opportunity to evaluate
the process traveler and artwork, the planner will not only have
a better understanding of the process, but the process engineering
department will have the opportunity to make changes prior to the
release of the product to production.
Items
to consider before the process traveler is generated:
Laminate
Material Performance
Many
manufacturing facilities have multiple laminate vendors, which in
turn have materials with different characteristics. For example,
the internal layer stretch compensation for one vendor's laminates
may differ greatly from that of another's.
Most
vendors provide this information at the outset as a guideline; however,
process studies for each material are necessary based on the specific
lamination press used. If this is not performed, problems due to
material movement and shrinkage will cause nightmares for the drilling
department. (Likewise, prepreg differs in thickness, flow, cure,
and stability.)
These
characteristics can be used as base guidelines for fabricators to
consider when planning the construction of the part.
By
streamlining the front-end process, fabricators can eliminate data
package bottlenecks and other related front-end issues. Doing so
improves quality, decreases cycle time, and increases profitability.
Shelley Krueger is director of front end engineering, Dave Barry is
vice president of engineering, and Don Payne is director of partner
manufacturing at ATOMIC29 (Los Altos, CA). They can be reached at
650/947-1529; www.ATOMIC29.com. ATOMIC29 supplies PCB manufacturers
with front-end engineering services and Internet-based infrastructures
(order placement, online DfM, and order tracking).

Copyright 2008, ATOMIC29. All rights reserved.
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